Fundamentals and Practices of Sensing Technologies

by Dr. Keiji Taniguchi, Hon. Professor of Engineering

University of Fukui, Fukui, Japan

Xi’ an University of Technology, Xi’ an, China

Dr. Masahiro Ueda, Honorary Professor, Faculty of Education and Regional Studies

 University of Fukui, Fukui, Japan

Dr. Ningfeng Zeng, an Engineer of Sysmex Corporation

(A Global Medical Instrument Corporation), Kobe, Japan

Dr. Kazuhiko Ishikawa, Assistant Professor

Faculty of Education and Regional Studies, University of Fukui, Fukui, Japan

 

[Editor’s Note: This paper is presented as Part VI of a series from the new book “Fundamentals and Practices of Sensing Technologies”; subsequent chapters will be featured in upcoming issues of this Journal.]

 

 

Chapter 3 (Section I):

Some Practical Examples of Recent Ceramic Sensors

 

Summary

Piezoelectric ceramics exhibit strong piezoelectric properties. In this chapter,

we describe briefly some physical sensors using piezoelectric ceramic material.

The descriptions that we provide are as follows: in section 3.1, infrared pyroelectric ceramic sensors; in section 3.2, knocking sensors; in section 3.3, rotary sensors; in section 3.4, shock sensors; in section 3.5, sonar sensors; and in section 3.6, piezoelectric vibrating gyro sensors.

 

3.1 Infrared Pyroelectric Ceramic Sensors (1)-(4)

Some electric charges are produced on the surfaces, when surfaces of a ceramic sensor, is irradiated by an infrared ray- beam. Such a phenomenon is caused at a lower temperature than the Curie temperature. This sensor is one of devices for converting a temperature into a voltage.

3.1.1   Structure and Photograph of Sensor

Figures 3.1(a) and (b) show the structure and the photograph of an infrared pyroelectric ceramic sensor, respectively.


(a) Structure of the sensor

(b) Photograph of the sensor
Fig.3.1 Structure and photograph of an infrared pyroelectric ceramic sensor
(Courtesy of Murata Manufacturing Co., Ltd.)

3.1.2   Operation of Sensor

The infrared pyroelectric ceramic sensor shown in Fig. 3.1, mainly consists of the following parts:

(1) An optical filter which can be passed through a frequency band in infrared ray,

(2) Two pyroelectric elements for converting the energy of infrared radiations into output voltage ,

(3) A FET source follower circuit for amplifying ,

(4) Capacitors for noise canceling.

 

3.1.3   Self Polarization Characteristics of Ceramics

Figure 3.2 (a) shows an example of the spontaneous polarization which occurs on the surface of the infrared pyroelectric ceramic element. The temperature on this surface is increased from to , when some of infrared ray-beam was radiated on the surface of the element as shown in case in this figure. The charges on the surface may, then, vary as shown in case , and the charges on the surface of the element yield the balanced state as shown in case.

However, when the infrared ray-beam becomes the off state, the temperature will again decrease from  toas shown in case , and the charges on surface of the element will return to the initial state as shown in case .

Figure. 3.2(b) shows the variations in charges due to the change of temperature on the surface of the pyroelectric ceramic element.

Fig.3.2 Illustration of the relationship between the temperature change and
the spontaneous polarization on the surface of the pyroelectric ceramic element
(Courtesy of Murata Manufacturing Co., Ltd.)

Figure 3.3 shows the relationship between the surface temperature and the spontaneous polarization  on  the pyroelectric ceramic element. This figure shows that is expressed as a function of the surface temperature in the range of temperature that is lower than the Curie-temperature.

Fig.3.3 Relationship between the change of temperature and the spontaneous polarization
on the surface of the pyroelectric ceramic element
(Courtesy of Murata Manufacturing Co., temperature Ltd.)

3.1.4   Signal Processing Circuit for Sensor

The signal processing circuit for the pyroelectric sensor is shown in Fig.3.4. The details of this circuit and its solution are described in problem 3.4.

 

Example 3.1As shown in Fig. 3.4(a), when an infrared source passes through the front of the infrared sensor,  the output voltageof this sensor is graphically demonstrated by the waveform  of  Fig. 3.4(b). The sensing elements A and B , are used as the differential connections. The output voltage of the source follower circuit is, then, produced so as to cancel the effect of the spontaneous polarization in the steady state of this sensor (See the point S shown in Fig.3.3). Therefore, this circuit operates in response to the infrared source moving in front of its sensor.

Fig.3.4 Relationship between moving infrared source and the output voltage
of a sensor (Courtesy of Murata Manufacturing Co., Ltd.)

3.1.5   Application Example of Sensor

The infrared pyroelectric ceramic sensors have high sensitivity and reliable performance. The example of a watching system for security using the infrared sensors set on both a wall and ceiling, is illustrated in Fig. 3.5. The output signals from these sensors are summarized and sent to the monitoring center by using LAN systems.

Fig.3.5 A security use of infrared pyroelecric ceramic sensors
(Courtesy of Murata Manufacturing Co., Ltd.)

3.2   Knocking Sensors (1)-(4)

3.2.1 Introduction

The knocking sensor is used for detecting knocking detonation occurred in an automotive engine. The knocking detonation causes abnormal vibrations. This sensor detects the abnormal vibrations.

3.2.2 Structures of Sensing Elements

Knocking sensors include both a resonant type and a non-resonant type. These sensing elements are shown in Fig 3.6.

Fig.3.6 Illustration of Sensing Elements
(Courtesy of Murata Manufacturing Co., Ltd.)

In this figure, elements and are used as the resonant type sensor which has  characteristics of the narrow frequency range and high sensitivity, and element is used as the non-resonant type element which has  characteristics of the wide frequency range and low sensitivity,.

The vibration modes of the elements shown in Figs.3.6  ,   and , are the thickness modes, and the radial one, respectively.

In the standard type in engines, the knocking frequency is known. So, the resonant type element is used as the sensing element.

3.2.3 Structure of Sensor

The knocking sensors of the resonant and non-resonant types, are shown in Fig.3.7. Figure3.8 also shows the outlines of frequency responses of these knocking sensors.

Fig.3.7 Two Types of Knocking Sensors
(Courtesy of Murata Manufacturing Co., Ltd.)

Fig. 3.8 Frequency Responses of Knocking Sensors
(Courtesy of Murata Manufacturing Co., Ltd.)

3.2.4   Practical Application of Knocking Sensor

This sensor is directly mounted on the automotive engine, and detects the abnormal vibrations occurred in the engine. As a feedback signal, the sensing signal is given to the engine control system for suppressing the knocking detonation.

 As a result, we can reduce exhaust emissions generated from automotive engines.

 

3.3 Rotary Sensors (1)-(4)

3.3.1 Characteristic of Semiconductor Magneto-Resistive Element

In a magnetic field , a path distribution of a current  becomes curved as shown in Fig. 3.9(b). A resistance  between electrodes is, then larger than that without magnetic field , as shown in Fig. 3.9(a). This phenomenon is well known as the magneto-resistance effect, and is used in a rotary sensor.

Fig.3.9 Current distribution model for magneto-resistive elements
(Courtesy of Murata Manufacturing Co., Ltd.)

Fig. 3.10 Relationship between B and R(B) / R(0)
(Courtesy of Murata Manufacturing Co., Ltd.)

3.3.2   Structure of Semiconductor Magneto-Resistive Sensor

Figure 3.11 shows the structure of a semiconductor magneto-resistive sensor. This sensor consists of two magneto-resistive elements (MR1, MR2) and a permanent magnet.

Fig.3.11 Structure of a semiconductor magneto-resistive sensor
(Courtesy of Murata Manufacturing Co., Ltd.)

3.3.3    Application Example of Sensor

Let us consider the measurement of revolutions per unit time of a spur gear using the magneto-resistive sensor shown in Fig.3.12 (a).

The operations and its output voltage waveforms of the sensor are shown in Fig.3.12 (b) and Fig.3.12 (c), respectively.

Fig. 3.12 Measurement of revolutions per unit time of a spur gear
using the magneto-resistive sensor
(Courtesy of Murata Manufacturing Co., Ltd.)

In this figure,and  are the magnetic resistances of the elements MR1 and MR2, respectively.

Firstly, when a tooth of spur gear faces on the sensor as shown in case in Fig. 3.12 ( b) , the magnetic flux in region 1, ,(: Cross sectional area of the region 1,  : Density of magnetic flux) , becomes larger than that in region 2,  ,(: Cross sectional area of the region 2,  : Density of magnetic flux), and the magnetic l resistance of the element MR1 is, then, larger than the magnetic resistance  of the element MR2,  i.e.,  . The output voltage  is, therefore smaller than  from Eq. (3.1).

Secondly, when  equals to  as shown in case in Fig.( b),    also equals to , i.e.,  (), and then   equals to  from Eq. (3.1).

Finally, when a tooth of spur gear faces on the sensor as shown in case in Fig. 3.12 ( b) , is larger than , and then  becomes larger than , i.e.,  . The output voltage  is, therefore larger than  from Eq. (3.1).

Figure. 3. 13 ( c ) shows the output voltage which is expressed as a function of the positions of teeth in the gear.

 

3.4   Shock Sensors (1)-(4)

3.4.1   Principle of Detection of Acceleration  

Figure 3.13(a) shows the outside view of a shock sensor. The shock sensor has one detect-axis of an acceleration per package. It consists of the following elements,   piezoelectric elements , upper and lower ceramic packages.  Piezoelectric elements are fixed on the center of two frames shown in Fig.3.13(b).

As shown in this figure, an inertial force that is caused by the acceleration, generates an output voltage from the piezoelectric ceramic elements in the shock sensor.

Fig.3.13 Shock sensor (Courtesy of Murata Manufacturing Co. Ltd.)

3.4.2   Q-V Conversion Circuit for Shock Sensor

Figs.3.14 (a) and (b) show a circuit for converting the electric charge obtained

from the piezoelectric ceramic element into the output voltage and its frequency

response of the conversion circuit , respectively.

Fig.3.14 Q-V conversion circuit and its frequency response
(Courtesy of Murata Manufacturing Co., Ltd.)

3.4.3   Application Example of Sensor

Figure 3.15 (a) shows the outside view of a hard-disk memory. As shown in Fig. 3.15 (b), shocks on this hard disk memory from upper and lower sides, may yield some false information for the selected truck and for some inner or outer or both unselected trucks of this memory. This false information is removed by means of this shock sensor, and thus we can prevent fault operation due to the shocks.

Fig. 3.15 Application example of the shock sensor
(Courtesy of Murata Manufacturing Co., Ltd.)

[Chapter 3 Part II will be presented in the upcoming March-April 2010 issue of this Journal.]



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